Dear Colleagues,
After the successful conclusion of the First International Conference on Laser Peening held in Houston in December 2008, the organizing committee has decided to proceed with the second edition this upcoming year. The Second International Conference on Laser Peening will take place in San Francisco from 19-21 of April 2010.
Laser-induced shock waves used for plastic deformation of metallic materials (Laser Peening) is a well-known technology since the early 1970s. Only in the past two decades there has been an increased interest in this technology for applications ranging from aeronautic to automotive fields. Recently major gas-turbine manufacturers brought in laser shock peening to improve fatigue performance of fatigue critical parts of engine components (e.g., engine blades). The residual stresses introduced by laser shock peening can also be used to drive curvature in metallic plates as under investigation by major aircraft manufacturers.
Still a lot must be done on Laser Shock Peening to allow it to become in time, a mature technology pervasive throughout industry. Looking to the future of laser shock peening, the goals remain: lowering processing cost, increase the understanding and the confidence of how to apply LSP, and to design the components taking into account the residual stresses induced by the process.
The conference is specifically designed to bring together the most relevant scientists/specialists from all over the world. This conference will enable them to exchange their knowledge and to discuss and cooperate on recent state-of-the-art innovative technologies related to Laser Peening/Laser Shock Processing, along with the latest developments and implementations in the industrial applications of laser peening. The scope of the conference will be dedicated not only to the academic or industrial community working on laser-peening systems or applications, but also to all those working on surface modification technologies or structural integrity interested by the emergence of this process.
The 2008 conference was attended by more than 70 participants representing more than 10 countries. This year, we plan to expand the technical program to include discussions on LSP challenges and comparisons with other residual stress technologies. Attendees of this event will have the opportunities to explore what has been done (or is currently ongoing) around the world about:
1) Fundamental aspects (Plasma Physics, Warm Dense Matter, Shock Phenomena, Material Dynamics)
2) Numerical simulation of LSP processes (Solid Phase, Hydrodynamics, Plasma)
3) Experimental implementation of processes and characterization techniques
4) Mechanical properties and behavior resulting from LSP conditions
i) LSP effects on residual stresses
ii) LSP effects on wear resistance and other surface properties
iii) LSP effects on fatigue behavior
iv) LSP effects on corrosion
5) Industrial applications of LSP
6) Comparison of LSP (Toshiba, MIC, LSPT, etc.) vs. different competing technologies (Shot Peening, Water Jet Peening, Ultrasonic Shot Peening, etc.)
7) Novel applications of laser peening
8) Challenges of Laser Peening/Laser Shock Processing
All submitted abstracts should enhance the technical discussion of the various initiatives and technology supporting the use of LSP. The general rules for submitting abstracts are listed under the general rules section.
Sincerely,
Omar Hatamleh
2010 Conference Chairman
NASA – Johnson Space Center |
